Fluid–Structure Interaction Study of IC Stacking Chips Arrangement During Encapsulation Process

Abstract

The purpose of this study is to present the experimental and simulation studies on the influence of stacking chips arrangement for a three-dimensional encapsulation process of 3D stacked flip-chip package. A bidirectional coupling method that adopted mesh-based coupling parallel was implemented. The encapsulation process was modelled using computational fluid dynamic software (FLUENT), while structural analysis was executed using finite element method software (STRUCTURAL). The results of this investigation show that edge regions of chip deformed due to the continuous force caused by the Epoxy molding compound (EMC). Furthermore, pressure differences between upper and lower streams also caused the edge regions of chip deformed. Furthermore, the results of this study indicate that staggered arrangement significantly reduced air traps for packages due to flow on top of the chip was slightly faster when the stacking arrangement changed.