Fluid–Structure Interaction Study of IC Stacking Chips Arrangement During Encapsulation Process

Mohammad Hafifi  Hafiz Ishak; Farzad  Ismail; Mohd Zulkifly  Abdullah; Mohd Sharizal  Abdul Aziz; Hamid  Yusoff; Mat  Tena’ain; Najib  Saedi; Abdul  Hamid

Authors

Mohammad Hafifi Hafiz Ishak School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia
Farzad Ismail School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia
Mohd Zulkifly Abdullah School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia
Mohd Sharizal Abdul Aziz School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia
Hamid Yusoff Faculty of Mechanical Engineering, Universiti Teknologi MARA, Cawangan Pulau Pinang, Malaysia
Mat Tena’ain RedRing Solder (Malaysia) Sdn. Bhd., 68100 Batu Caves, Selangor, Malaysia
Najib Saedi RedRing Solder (Malaysia) Sdn. Bhd., 68100 Batu Caves, Selangor, Malaysia
Abdul Hamid RedRing Solder (Malaysia) Sdn. Bhd., 68100 Batu Caves, Selangor, Malaysia

Keywords:

fluid–structure interaction, transient deformation, transient dynamic stress, chip stacking

Abstract

The purpose of this study is to present the experimental and simulation studies on the influence of stacking chips arrangement for a three-dimensional encapsulation process of 3D stacked flip-chip package. A bidirectional coupling method that adopted mesh-based coupling parallel was implemented. The encapsulation process was modelled using computational fluid dynamic software (FLUENT), while structural analysis was executed using finite element method software (STRUCTURAL). The results of this investigation show that edge regions of chip deformed due to the continuous force caused by the Epoxy molding compound (EMC). Furthermore, pressure differences between upper and lower streams also caused the edge regions of chip deformed. Furthermore, the results of this study indicate that staggered arrangement significantly reduced air traps for packages due to flow on top of the chip was slightly faster when the stacking arrangement changed.