BALABEL, A. .; SAKR, I. . Effect of High Level Differential Heating on Failure of Encapsulated Chips and Semiconductors. CFD Letters, [S. l.], v. 4, n. 2, p. 54–67, 2021. Disponível em: https://akademiabaru.com/submit/index.php/cfdl/article/view/3349. Acesso em: 24 nov. 2024.