SAHRUDIN, I. N.; ABDUL AZIZ, M. S. .; ABDULLAH, M. Z. .; MOHD SALLEH, M. A. A. . Study on the Addition of Nanoparticles in the Lead-free Solder During Reflow Soldering via Numerical Simulation - A Review. CFD Letters, [S. l.], v. 12, n. 5, p. 111–119, 2021. Disponível em: https://akademiabaru.com/submit/index.php/cfdl/article/view/3250. Acesso em: 24 nov. 2024.