HAFIZ ISHAK, M. H. .; ISMAIL, F. .; ABDULLAH, M. Z. .; ABDUL AZIZ, M. S. .; YUSOFF, H. .; TENA’AIN, M. .; SAEDI, N. .; HAMID, A. . Fluid–Structure Interaction Study of IC Stacking Chips Arrangement During Encapsulation Process. CFD Letters, [S. l.], v. 11, n. 4, p. 1–15, 2021. Disponível em: https://akademiabaru.com/submit/index.php/cfdl/article/view/3151. Acesso em: 21 nov. 2024.