The Effect of Isothermal Aging on the Intermetallic Growth between SN100C Lead-Free Solders and ENIG Surface Finish

Authors

  • Dayang Izzah Nabilah Awang Azman Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Parit Raja, Batu Pahat, Johor, 86400, Malaysia
  • Saliza Azlina Osman Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Parit Raja, Batu Pahat, Johor, 86400, Malaysia
  • Pavithiran Narayanan Nihon Superior (M) Sdn. Bhd., Free Industrial Zone Jelapanag 2, 30020 Ipoh, Perak, Malaysia
  • Yuji Kozutsumi Nihon Superior (M) Sdn. Bhd., Free Industrial Zone Jelapanag 2, 30020 Ipoh, Perak, Malaysia

DOI:

https://doi.org/10.37934/armne.17.1.6975

Keywords:

Lead-free solder, reflow soldering, intermetallic compound (IMC), isothermal ageing, SN100C, ENIG

Abstract

The selection of substrate material depends on solder joint requirements and will influence intermetallic compound (IMC) layer formation and reliability of the solder joints. Besides, using different solder materials can also affect the microstructure of IMCs formed during soldering and isothermal ageing process. This study investigated the effect of the IMC formation and microstructure evolution during reflow soldering and isothermal ageing using SN100C lead-free solders and ENIG surface finish. The characterization of the IMC formed during both reflow soldering and isothermal ageing in terms of the type, morphology, and thickness is then analyzed by using the Optical Microscope (OM), Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX). The result reveals that there are two IMC formed at an interface between SN100C and ENIG which are (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 where (Ni, Cu)3Sn4 grows beneath (Cu, Ni)6Sn5. The thickness of the IMC formation in the SN100C/ENIG solder joint is also directly proportional to the ageing duration, indicating that the longer the time of the IMC exposed to high temperature affects the thickness of the IMC.

Author Biographies

Dayang Izzah Nabilah Awang Azman, Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Parit Raja, Batu Pahat, Johor, 86400, Malaysia

hd210032@student.uthm.edu.my

Saliza Azlina Osman, Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Parit Raja, Batu Pahat, Johor, 86400, Malaysia

salizaz@uthm.edu.my

Pavithiran Narayanan, Nihon Superior (M) Sdn. Bhd., Free Industrial Zone Jelapanag 2, 30020 Ipoh, Perak, Malaysia

pavithiran@nihonsuperior.com.my

Yuji Kozutsumi, Nihon Superior (M) Sdn. Bhd., Free Industrial Zone Jelapanag 2, 30020 Ipoh, Perak, Malaysia

kozutsumi@nihonsuperior.com.my

Downloads

Published

2024-03-30

How to Cite

Dayang Izzah Nabilah Awang Azman, Saliza Azlina Osman, Pavithiran Narayanan, and Yuji Kozutsumi. 2024. “The Effect of Isothermal Aging on the Intermetallic Growth Between SN100C Lead-Free Solders and ENIG Surface Finish”. Journal of Advanced Research in Micro and Nano Engineering 17 (1):69-75. https://doi.org/10.37934/armne.17.1.6975.
سرور مجازی ایران Decentralized Exchange

Issue

Section

Articles
فروشگاه اینترنتی