Study of Thermal-Fluid Analysis on Fusible Metal Bonding Application

Abstract

Due to the rapid growth of wireless communication systems, high frequency packages become very important and they require compactness, low cost and high performances. Flip-chip assembly using organic substrate at very high frequency has become a cost competitive packaging method in semiconductor industries. Copper pillar interconnects are a popular interposing option due to the advantages of small pillar size and good thermal and electrical performance, making copper pillar interconnects very useful for high-frequency and high-density flip-chip packages. However, the challenges associated with the technology include controlling the formation of intermetallic compounds (IMC) and weak interfaces during heat-related processes. This paper discusses the influence of various temperature bonding on copper pillar solder joints reliability by using flip chip device. Testing on the flip chip samples will be tested and to determine the failure analysis of flip chip bonding after hot reflow process. The test results show that the interconnection of copper pillar can effectively be improved by controlling the temperature setting of the bonding process. The basic requirements of the joining material and the process will be discussed in this study.