Numerical Heat Transfer Analysis in Microchannel Heat Sink with Different Aspect Ratio

Abstract

The cooling of electronic devices is essential to guarantee their functional performance and operational lifetime. Due to continued miniaturization and integration of transistors in packaged chips, the heat dissipation rate has surpassed the limits of classical air-cooled heat sinks. This has triggered a lot of research towards alternatives for high heat flux cooling. Liquid cooling with micro heat sinks is one of these candidate solutions. Cold liquid flows through microscopic channels to extract heat from the chip. In this paper, the studied is focused on the effect of aspect ratio in the Microchannel Heat Sink (MCHS) using numerical analysis, and the result obtained is discussed in this paper. The overall result of the present work shows there is a close relationship between both the numerical and analytical data.