A Review on Development of Liquid Cooling System for Central Processing Unit (CPU)

Authors

  • Muhammad Arif Harun Malaysia-Japan International Institute of Technology, Universiti Teknologi Malaysia, Jalan Sultan Yahya Petra, 54100 Kuala Lumpur, Malaysia
  • Nor Azwadi Che Sidik Malaysia-Japan International Institute of Technology, Universiti Teknologi Malaysia, Jalan Sultan Yahya Petra, 54100 Kuala Lumpur, Malaysia

Keywords:

Liquid cooling, Central Processing Unit, Nanofluid

Abstract

Electronic devices are becoming more efficient while getting a smaller size and compact design thus increase heat generation significantly. High heat generation from high technology electronic devices are needed to be cool down or control its temperature to prevent overheating problems. Due to the high cooling performance of liquid cooling, the electronic cooling system is shifting from an air-cooling system to a liquid cooling system. In the past few decades, numerous methods proposed by researchers for the central process unit (CPU) cooling using the liquid system either active cooling or passive cooling system. Other than physical configuration such as heat sink design, different configurations of working fluids are widely been studied by most of the researchers. Different working fluids have different heat transfer performance. Furthermore, a recent study has come out more interesting finding using nanofluid which can enhance heat transfer performance of liquid cooling. Nanofluid is a working fluid that has nanoparticles disperse in the base fluid which can increase the thermal properties of the based fluid. In this paper, comprehensive literature on the type of working fluid used in the respective system and methods of liquid cooling system for CPU including its cooling performance. Furthermore, this review paper discussed the different configuration of the liquid block and also the working fluid that had been used in the CPU cooling system.

Published

2021-07-20
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